Modeling using surface patches in PIES for elastoplastic boundary value problems

10.08.2016

C. Bagiński

Modeling using surface patches in PIES for elastoplastic boundary value problems

12th World Congress on Computational Mechanics and 6th Asia-Pacific Congress on Computational Mechanics, Seul, Korea Południowa, Jul 24-29, 2016

The Korean Society of Mechanical Engineers, Korean Society for Computational Mechanics (org.)

©2022 Wszystkie prawa zastrzeżone.